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Cobalt-sheated lines prevent electromigration in the 10nm

Posted: 14 May 2014     Print Version  Bookmark and Share

Keywords:Applied Materials  10nm  electromigration  cobalt  copper 

[Summary of tips] Connecting billions of transistors using conventional copper interconnects is getting tougher in today's sub-22nm chips. The quality of the copper lines is yielding open circuits instead of voids as the number of metallisation layers goes up from 9 to 15 or more. While there are existing proposals to address this problem, Calif......
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