Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
 
EE Times-Asia > Manufacturing/Packaging
 
 
Manufacturing/Packaging  

Advances in power converter packaging

Posted: 10 Apr 2014     Print Version  Bookmark and Share

Keywords:Electronic systems  FPGAs  micro-BGA  chip-scale-package  power MOSFETs 

[Summary of tips] Electronic systems nowadays, especially those in areas such as telecommunications infrastructure, networking and data management, pack increasing number of functionalities into smaller and smaller profiles. The microprocessors and other highly-integrated ICs on which they are based require correspondingly greater levels of powe......
Please login or register with us to view this article>>
1 • 2 • 3 Next Page Last Page
 


Article Comments - Advances in power converter packagin...
Comments:  
*  You can enter [0] more charecters.
*Verify code:
 
 
Webinars

Seminars

Visit Asia Webinars to learn about the latest in technology and get practical design tips.

 
 
Back to Top