Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
EE Times-Asia > Networks

On-chip interconnect costs head for further study

Posted: 28 Mar 2014     Print Version  Bookmark and Share

Keywords:interconnect  BEOL  Qualcomm  Globalfoundries 

[Summary of tips] As a result of 16nm chips moving to production in 2014, companies are actively developing the 10nm and 7nm technology nodes. These generations are interconnect heavy, more than 50 per cent of their cost is due to the back-end-of-line (BEOL) wiring levels, and designs are dominated by interconnect delay."Interconnect performance......
Please login or register with us to view this article>>

Article Comments - On-chip interconnect costs head for ...
*  You can enter [0] more charecters.
*Verify code:


Visit Asia Webinars to learn about the latest in technology and get practical design tips.

Back to Top