Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
 
EE Times-Asia > Manufacturing/Packaging
 
 
Manufacturing/Packaging  

MEI develops advanced metal lift-off system

Posted: 21 Mar 2014     Print Version  Bookmark and Share

Keywords:metal lift-off  wet processing system  FluidJet  wafer 

[Summary of tips] MEI introduces FluidJet batch wet processing system for metal lift-off in MEMS manufacturing, delivering higher yielding, more cost effective metal lift-off processing.MEI's FluidJet batch wet processing system for metal lift-off works with no metal re-deposition on either the front side or back side of the wafer, and eliminate......
Please login or register with us to view this article>>
 


Article Comments - MEI develops advanced metal lift-off...
Comments:  
*  You can enter [0] more charecters.
*Verify code:
 
 
Webinars

Seminars

Visit Asia Webinars to learn about the latest in technology and get practical design tips.

 
 
Back to Top