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STATS ChipPAC unveils novel wafer level manufacturing

Posted: 13 Mar 2014     Print Version  Bookmark and Share

Keywords:STATS ChipPAC  wafer level manufacturing  supply chain  WLP 

[Summary of tips] STATS ChipPAC Ltd has developed what it describes as a manufacturing method that delivers a high level of flexibility and cost savings for wafer level packaging (WLP). According to the company, FlexLine enables customers to simplify their supply chain across multiple devices, thereby achieving significant cost reductions that a......
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