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ThruChip opts for wireless wafer stacking

Posted: 25 Feb 2014     Print Version  Bookmark and Share

Keywords:TSV  stack  coupling  wireless 

[Summary of tips] ThruChip Communications has an inductive coupling link in the works, which is said could save 40 per cent costs of through-silicon vias (TSVs), eliminating wired links that engineers craft for 3D stacks.Veteran microprocessor designer Dave Ditzel was recently named CEO of the technology-licensing start-up. He believes that the ......
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