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Moisture sensitivity levels for plastic-encapsulated ICs

Posted: 28 Feb 2014  Print Version  Bookmark and Share Subscribe 

Keywords:plastic encapsulated microcircuits  printed circuit board  popcorning  reflow  JEDEC 

[Summary of tips] When plastic-encapsulated microcircuits are on the assembly floor, waiting to be mounted on a printed circuit board, they will absorb moisture from the environment. Water molecules percolate into the mold compound. They typically come to rest at material interfaces, such as the interface between a mold compound and the die, or ......
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