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Tips for cost-effective 3D IC production

Posted: 19 Feb 2014  Print Version  Bookmark and Share Subscribe 

Keywords:3D IC  Through Silicon Vias  TSVs  printed circuit board  PCB 

[Summary of tips] From a manufacturer's point of view, 3D IC production will only ramp up if the added costs for implementing Through Silicon Vias (TSVs) and all the subsequent processing steps can be largely compensated by the IC performance benefits, or if the process and materials costs are drastically reduced. One of the big questions at Gre......
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