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Manufacturing/Packaging  

Ball grid array replaces standard IC packaging

Posted: 13 Feb 2014     Print Version  Bookmark and Share

Keywords:semiconductor  packaging  flip-chip 

[Summary of tips] Flip-chip BGA has transformed the way the industry puts the devices into a package, abandoning the practice of sourcing products from different businesses.Do you remember the days when a semiconductor product was multi-sourced and presented in standard packaging? Standard packaging used to be basic through-hole products like DI......
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