Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
EE Times-Asia > Manufacturing/Packaging
 
 
Manufacturing/Packaging  

EVG outs high-volume-mfg photoresist processing system

Posted: 13 Feb 2014  Print Version  Bookmark and Share Subscribe 

Keywords:EVG  photoresist  TSV  3D IC  interposer manufacturing 

[Summary of tips] EV Group (EVG) has rolled out what it describes as its most advanced 300mm photoresist processing system for logic and memory high-volume manufacturing (HVM). The EVG150XT resist coating and developing system boasts its XT Frame platform used across its spectrum of industry-leading systems, and is optimized for ultra-high throu......
Please login or register with us to view this article>>
 


Article Comments - EVG outs high-volume-mfg photoresist...
Comments:  
*  You can enter [0] more charecters.
*Verify code:
 
Christmas Wishlist
 
 
Back to Top