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3D TSV Summit underscores cost-effective production

Posted: 06 Feb 2014     Print Version  Bookmark and Share

Keywords:TSMC EMEA  3D IC  MEMS  TSV integration 

[Summary of tips] At the recent 3D TSV Summit in Grenoble, a resounding question among the crowd was how to distribute the cost-of-ownership across the supply chain. From a maker's perspective, 3D IC production will only ramp up if the added costs for implementing Through Silicon Vias (TSVs) and all the succeeding steps can be compensated by the......
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