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Besi, Imec partner on thermocompression for 3D IC bonding

Posted: 22 Jan 2014     Print Version  Bookmark and Share

Keywords:thermocompression technology  bonding  3D ICs  IC manufacturing 

[Summary of tips] Imec and Besi announced this week that they are jointly developing a thermocompression bonding solution for narrow-pitch die-to-die and die-to-wafer bonding with high accuracy and high throughput. The partnership is anticipated to open the way for industrial adoption of thermocompression bonding for 3D IC manufacturing.3D IC te......
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