Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
EE Times-Asia > Manufacturing/Packaging

Double-layer capping improves packaging for MEMS devices

Posted: 20 Jan 2014     Print Version  Bookmark and Share

Keywords:A*STAR Institute of Microelectronics  MEMS  sensor  switch  radio filter 

[Summary of tips] A team of researchers at A*STAR Institute of Microelectronics, Singapore has created an innovative technology that promises safe and functional encasements for microelectromechanical systems (MEMS) such as sensors, switches or radio filters."MEMS devices need certain ambient conditions to operate properly and have fragile hangi......
Please login or register with us to view this article>>

Article Comments - Double-layer capping improves packag...
*  You can enter [0] more charecters.
*Verify code:


Visit Asia Webinars to learn about the latest in technology and get practical design tips.

Back to Top