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3D integration leads to robust I/O performance, says IBM

Posted: 16 Jan 2014  Print Version  Bookmark and Share

Keywords:3D  silicon  2.5D  semiconductor packaging  CMOS 

[Summary of tips] IBM is looking for alternatives to CMOS technology and Von Neumann architecture. Semiconductor packaging of integrated bipolar silicon is needed. In addition, 3D integration allows for strong I/O performance; 2.5D and improved materials are also highly beneficial as IBM looks for cost-effective means of semiconductor packaging.......
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