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Manufacturing/Packaging  

Industry collaboration seen to ease advanced-node issues

Posted: 18 Dec 2013  Print Version  Bookmark and Share Subscribe 

Keywords:Coventor  Globalfoundries  chip scaling  EUV lithography  FEOL architecture 

[Summary of tips] Industry researchers agree on this: the job of making advanced chips and finding ways to collaborate on the work is getting tougher. During the International Electron Devices Meeting in Washington, moderator David Fried, CTO of Coventor, a supplier of 3D modeling and simulation software, asked panelists to describe the biggest ......
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