Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
EE Times-Asia > Manufacturing/Packaging
 
 
Manufacturing/Packaging  

Monolithic 3D ICs gain momentum

Posted: 18 Dec 2013  Print Version  Bookmark and Share Subscribe 

Keywords:Monolithic 3D IC  Qualcomm  Broadcom  Nvidia  AMD 

[Summary of tips] A recent report on the Solid State Technology website has described how momentum is building for monolithic 3D ICs. Dimensional scaling is clearly not providing transistor cost reduction beyond the 28nm process node, as has been recently confirmed by reports from the large fabless companies such as Qualcomm, Broadcom, Nvidia an......
Please login or register with us to view this article>>
 


Article Comments - Monolithic 3D ICs gain momentum
Comments:  
*  You can enter [0] more charecters.
*Verify code:
 
Christmas Wishlist
 
 
Back to Top