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Latest developments in 3D IC technologies

Posted: 13 Dec 2013  Print Version  Bookmark and Share Subscribe 

Keywords:3D ICs  system-in-package  SiP  wafer  wire-bond 

[Summary of tips] When we ponder what the world used to be like before the dawn of 3D ICs, we think about the use of lots of small, individually-packaged dice, the advent of system-on-chip (SoC) devices, and the introduction of system-in-package (SiP) assemblies.In this article, we will consider the various forms of 3D IC technology, starting wi......
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