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Imec, Cascade probe 25µm-diameter micro-bumps

Posted: 02 Aug 2013  Print Version  Bookmark and Share Subscribe 

Keywords:3D-SIC  micro-bumps  TSV 

[Summary of tips] Cascade Microtech and Imec have revealed what they claim as breakthroughs in probing stacked ICs (3D-SICs). Through a joint development agreement, Cascade Microtech Inc. teamed up with Imec to successfully probe 25µm-diameter micro-bumps on a wide I/O test wafer with its fully-automated CM300 probe solution using an advanc......
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