Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
EE Times-Asia > Manufacturing/Packaging

Imec, Cascade probe 25µm-diameter micro-bumps

Posted: 02 Aug 2013     Print Version  Bookmark and Share

Keywords:3D-SIC  micro-bumps  TSV 

[Summary of tips] Cascade Microtech and Imec have revealed what they claim as breakthroughs in probing stacked ICs (3D-SICs). Through a joint development agreement, Cascade Microtech Inc. teamed up with Imec to successfully probe 25µm-diameter micro-bumps on a wide I/O test wafer with its fully-automated CM300 probe solution using an advanc......
Please login or register with us to view this article>>

Article Comments - Imec, Cascade probe 25µm-diamet...
*  You can enter [0] more charecters.
*Verify code:


Visit Asia Webinars to learn about the latest in technology and get practical design tips.

Back to Top