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3D stacking is the future of chip design, says Xilinx

Posted: 28 Mar 2013  Print Version  Bookmark and Share Subscribe 

Keywords:3D  SoCs  design 

[Summary of tips] Since the beginning of semiconductor development, chip designers have stuck with Moore's Law, integrating more and more functionality onto their chips. Veteran chip architect Liam Madden, vice president of FPGA development at Xilinx, said during his keynote speech at the annual International Symposium on Physical Systems, that ......
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