Manufacturing/Packaging 
Flip-chip platform to lift wafer shipments
Keywords:flip-chip 3D IC wafers CMOS
[Summary of tips] The flip-chip platform will grow by threefold over the next five years to reach over 40 million 12" equivalent wafer (eq) start per year, according to research firm Yole Développement.IBM first introduced the flip chip process over 30 years ago, updating it constantly with new bumping solutions to serve the most advanced t......Please login or register with us to view this article>>
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