Manufacturing/Packaging 
ASML still believes EUV at 10nm ideal
Keywords:EUV wafers manufacturing
[Summary of tips] Consistent progress on the extreme ultraviolet lithography (EUV) front will make it the best option of manufacturing ICs at the 10nm node and below, ASML emphasized during the International Solid State Circuits Conference (ISSCC).Using double patterning and other techniques, EUV can make devices at 7nm and 3nm nodes, Martin van......Please login or register with us to view this article>>
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