Manufacturing/Packaging 
Open ecosystem team up spawns 3D IC
Keywords:memory test chip TSV package-level reliability FEOL 3D chip stack
[Summary of tips] STATS ChipPAC Ltd. and United Microelectronics Corp. (UMC) have demonstrated what they say is the world's TSV-enabled 3D IC chip stacking technology developed under an open ecosystem partnership. The 3D chip stack, which consists of a Wide I/O memory test chip stacked upon a TSV-embedded 28nm processor test chip, reached a majo......Please login or register with us to view this article>>
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