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Imec, Cadence team up for DFT solution for 3D memory

Posted: 24 Jan 2013  Print Version  Bookmark and Share Subscribe 

Keywords:test logic-memory interconnects  DRAM-on-logic stacks  Wide-I/O mobile  design-for-test  ATPG approach 

[Summary of tips] Nano-electronics research institute imec, has recently announced that it has teamed up with Cadence Design Systems to develop, implement and validate an automated 3D Design-for-Test (DFT) solution to test logic-memory interconnects in DRAM-on-logic stacks. Based on Cadence Encounter technology, the solution was verified on an i......
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