T&M 
Characterising low-dielectric-constant films
Keywords:instrumented indentation Continuous Stiffness Measurement thin-film
[Summary of tips] Mechanical characterisation of low-K films deposited on silicon is the single largest application for instrumented indentation. Thus, Agilent has continually sought test procedures and analyses which improve accuracy and minimise testing time for these kinds of samples. Typical low-K wafers are shown in this document. For a lon......Please login or register with us to view this article>>
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