Manufacturing/Packaging 
Imec, PVA Tepla demo 3D TSV void detection
Keywords:3D TSV void detection scanning acoustic microscopy SAM AutoWafer 300
[Summary of tips] Imec and PVA Tepla have shown what they claim is an innovative detection of TSV voids in 3D stacked IC technology. The organisations have applied scanning acoustic microscopy (SAM) to detect TSV voids at wafer-level after TSV copper plating.The initial focus of the collaboration was on developing metrology aimed at detecting vo......Please login or register with us to view this article>>
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