Manufacturing/Packaging 
Thick plated copper process for monolithic PMIC apps
Keywords:power management PMIC thick plated copper TPC process
[Summary of tips] United Microelectronics Corp. (UMC) has unveiled a thick plated copper (TPC) process for power management IC (PMIC) applications. The TPC solution, developed with Taiwan-based packaging house Chipbond Technology Corp., offers thick plated copper layers to achieve higher current flow and better thermal dissipation, reducing chip......Please login or register with us to view this article>>
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