Interface
TSMC preps CoWoS test car with JEDEC Wide I/O DRAM Interface
Keywords:CoWoS Wide I/O DRAM JEDEC
[Summary of tips] TSMC has revealed that it has taped out what it says is the foundry segment's first Chip on Wafer on Substrate (CoWoS) test vehicle using JEDEC Solid State Technology Association's Wide I/O mobile DRAM interface. According to the company, the milestone demonstrates the industry's system integration trend to achieve increased ba......Please login or register with us to view this article>>
|
Registered already? Login to view complete content.
|
| Related Articles | Editor's Choice |
Article Comments - TSMC preps CoWoS test car with JEDEC...
Visitor(To avoid code verification, simply login or register with us. It is fast and free!)
Top Ranked Articles
Christmas Wishlist

All I want for Christmas is anything on this year's Best of Innovations Design and Engineering Award list!
Search EE Times Asia


