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TSMC preps CoWoS test car with JEDEC Wide I/O DRAM Interface

Posted: 16 Oct 2012  Print Version  Bookmark and Share Subscribe 

Keywords:CoWoS  Wide I/O  DRAM  JEDEC 

[Summary of tips] TSMC has revealed that it has taped out what it says is the foundry segment's first Chip on Wafer on Substrate (CoWoS) test vehicle using JEDEC Solid State Technology Association's Wide I/O mobile DRAM interface. According to the company, the milestone demonstrates the industry's system integration trend to achieve increased ba......
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