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ST pushes for wireless MEMS

Posted: 05 Oct 2012  Print Version  Bookmark and Share Subscribe 

Keywords:system-in-package  MEMS  CMOS wafer sensors 

[Summary of tips] Geneva-based STMicroelectronics is advocating the use of system-in-package (SIP) to produce wireless microelectromechanical systems (MEMS) components and eventually integrate gas sensors in environmental MEMS in the next two years.Europe's largest semiconductor chip maker retains its market leadership with annual sales of about......
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