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A*STAR, Hitachi Chemical team up on 3D IC packaging tech

Posted: 17 Sep 2012  Print Version  Bookmark and Share Subscribe 

Keywords:3D IC packaging  mobile handsets  computers  gaming platforms 

[Summary of tips] A*STAR's Institute of Microelectronics, and Hitachi Chemical Co., Ltd. have announced their collaboration on a joint research of high performance material technologies to support thin wafer processing for 3D IC packaging. Through this research collaboration, Hitachi Chemical hopes to leverage IME's advanced 3D IC process capabi......
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