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Samsung chief cites challenges facing IC design
Keywords:FinFET 3D NAND TSV read-assist write-assist
[Summary of tips] Oh-Hyun Kwon, president of Samsung Electronics Co. Ltd's semiconductor business, cited and explained the four key challenges confronting next-generation IC design and scaling. Delivering the keynote at the 2011 International Solid-State Circuits Conference (ISSCC), Kwon also dwelled on phase-change memory and green manufacturin......Please login or register with us to view this article>>
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