Memory/Storage 
Thermal implications for die stacks
Keywords: die stacks handset simulation application processor
[Summary of tips] Mobile applications require memory to meet ever-more-stringent criteria for speed, power consumption and package footprint. As access speeds increase, mounting the memory closer to the applications processor is key to optimizing signal quality.Stacking memory either in the same package as the applications processor or in a pack......Please login or register with us to view this article>>
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