EDA/IP 
IMEC, Synopsys join hands on 3D stacked ICs
Keywords: 3D stacked IC through-silicon vias TSV
[Summary of tips] Synopsys Inc. and IMEC have entered into a collaboration to use Synopsys TCAD (Technology Computer-Aided Design) finite-element method tools for characterizing and optimizing the reliability and electrical performance of through-silicon vias (TSVs). The collaboration will accelerate the development of 3D stacked IC technologies......Please login or register with us to view this article>>
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