Manufacturing/Packaging 
Panel tackles outsourcing tradeoffs
Keywords: IC outsourcing design service intellectual property EDA
[Summary of tips] A panel discussion at the DesignCon 2010 conference centered on the evolution of the IC outsourcing model—and its implications. The conclusion: IC outsourcing—which involves the migration of chip design, packaging, wafer production and even operations to third parties—enables companies to cut costs and focus o......Please login or register with us to view this article>>
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