Manufacturing/Packaging 
Intel, Carnegie Mellon work on solder nanocomposites
Keywords: solder magnetic nanocomposite computer chip electronic packaging
[Summary of tips] Carnegie Mellon University and Intel Corp. are working on a new class of materials called solder magnetic nanocomposites that could help streamline the process of computer electronic packaging. The research will be discussed at the 11th annual Magnetism and Magnetics Materials Conference Jan. 18-22 at the Marriott Washington Wa......Please login or register with us to view this article>>
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