Power/Alternative Energy 
Assembly guidelines for Dual Power56 Packaging
Keywords: Packaging Power56 assembly processing soldering assembly dual power56
[Summary of tips] The Fairchild Dual Power56 package is based on Molded Leadless Packaging (MLP) technology. This technology has been increasingly used in packaging for power-related products due to its thermal performance with large thermal pads in the center of the package, which solder directly to the printed wiring board (PWB). Modularity in......Please login or register with us to view this article>>
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