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Manufacturing/Packaging  

IMEC pushes 3D integration of DRAM on logic

Posted: 06 Oct 2009  Print Version  Bookmark and Share Subscribe

Keywords: 3D  DRAM  logic IC 

[Summary of tips] IMEC and its 3D integration partners have prototyped a 3D chip integrating a commercial DRAM chip on top of a logic IC. The new 3D stack, dubbed Etna, resembles future commercial chips as closely as possible. It is comprised of a 25µm thick logic die with a commercial DRAM stacked on top using through-silicon vias (TSVs) a......
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