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Board support package rolls for TI OMAP 3
Keywords: board support package evaluation module TI OMAP
[Summary of tips] Bsquare Corp. is offering an optimized Microsoft Windows Embedded CE 6.0 R3 board support package (BSP) for Texas Instruments Inc.'s OMAP 3 evaluation module (EVM).The new Windows Embedded CE 6.0 R3 BSP ships with OpenGL ES 2.0 technology that takes advantage of the TI OMAP35x 3D PowerVR SGX graphics engine, which allows OEMs t......Please login or register with us to view this article>>
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