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Manufacturing/Packaging  

Duo works on bonding solution for 3D packaging

Posted: 14 Jul 2009  Print Version  Bookmark and Share Subscribe

Keywords: 3D packaging  bonding solution  wafer handling 

[Summary of tips] SUSS MicroTec and Thin Materials AG are cooperating on a temporary bonding solution to be used for challenging thin wafer-handling technologies required for emerging 3D integration and packaging technologies. With this cooperation, SUSS MicroTec extends its solution portfolio for temporary bonding and thin wafer handling.The te......
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