Manufacturing/Packaging 
Joint effort aims to enable 3D semiconductors
Keywords: TSV joint effort semiconductors 3D thinning wafer
[Summary of tips] Applied Materials Inc. and Disco Corp. have announced a joint effort to develop wafer thinning processes for fabricating through-silicon vias (TSVs) in 3D semiconductors. The two companies will be working together to develop integrated, high-performance process flows intended to lower the cost, reduce the risk and accelerate ti......Please login or register with us to view this article>>
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