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Manufacturing/Packaging  

FCI, SMIC: new 300mm flip chip allies

Posted: 18 Mar 2009  Print Version  Bookmark and Share Subscribe

Keywords: flip chip  300mm wafer  packaging bumping 

[Summary of tips] FlipChip International (FCI) has formed a partnership alliance with Semiconductor Manufacturing International Corp. for 300mm flip chip bumping and wafer-level packaging.Under this strategic partnership, FCI and SMIC will jointly promote SMIC's advanced 300mm bumping fab in Shanghai's Pudong district. FCI's participation will b......
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