Global Sources
EE Times-Asia
Advanced Search
News
Products
Technical Articles
App Notes
ForumBlogsWhite PapersDatasheetsWebinars
 Challenges & Opportunities 2011   HDTV   PCIe   HDMI   sensor   WiMAX
EE Times-Asia > Manufacturing/Packaging
 
 
Manufacturing/Packaging  

Partners enhance process co-optimization

Posted: 27 Feb 2009  Print Version  Bookmark and Share Subscribe

Keywords: partnership lithography  technology design  optimization 

[Summary of tips] Taiwan Semiconductor Manufacturing Co. Ltd and Tela Innovations announced a strategic partnership to develop co-optimized design solutions using Tela's patented lithography-optimized design technology and TSMC's derivative processes.In addition, TSMC and Tela have agreed to jointly support and enhance TSMC's PowerTrim Service b......
Please login or register with us to view this article>>
 

votes:   Add to Favorites
Panelists skeptical on next-gen lith...
Gartner sounds alarm over revenue di...
Article Comments - Partners enhance process co-optimiza...
Comments:  
*  You can enter [0] more charecters.
*Verify code:
 
Top Ranked Articles
High-quality Articles
Christmas Wishlist
    Kindle Fire Hot CE innovations at the CES

    All I want for Christmas is any of this year's Best of Innovations Design and Engineering Award honorees! Here's the EE Times pick for Top 10 CE gadgets.

Search EE Times Asia
Peek at Hot Gadgets for 2012
Smart energy "Try explaining to your eight-year-old son that instead of an Xbox, you got him a Wi-Fi enabled smart energy thermostat to help minimize his energy consumption and carbon footprint..."
 

Go to top