EDA/IP 
Joint research to reduce chip footprint by 10x
Keywords: footprint chip collaboration research reduce footprint chip
[Summary of tips] Semiconductor Research Corp. (SRC) and Georgia Tech have joined forces for a $2.5 million collaboration among academic, industry and government that will create the Interconnect and Packaging Center (IPC) based at Georgia Tech. Results from the joint research are expected to enable a reduction in chip footprint by a factor of 1......Please login or register with us to view this article>>
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