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Wafer-level packaging achieves prominence
Keywords: 3D wafer MEMS IC Package
[Summary of tips] Wafer-level packaging (WLP), the fabrication of the IC package directly on the wafer, is finally getting exposure after many years of promises, according to an expert in the field."While challenges remain for the technology, WLP is moving toward a new class of IC devices in the marketplace, such as 3D products, MEMS, among othe......Please login or register with us to view this article>>
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