EDA/IP 
Reap the rewards of package-aware design
Keywords: chip package design I/O process planning 45nm
[Summary of tips] Even though companies sell packaged devices and not bare chips, chips are often designed in isolation and may be either overdesigned or too large to fit the package. When chip-level I/O planning is done with no consideration of the package or the rest of the system, the result may be overly complex or unroutable package designs......Please login or register with us to view this article>>
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