EDA/IP 
Tegal secures products, IP for 3D packaging, MEMS
Keywords: Tegal IP product packaging 3D MEMS
[Summary of tips] Tegal Corp. has signed an agreement with Alcatel Micro Machining Systems (AMMS) and Alcatel-Lucent to acquire their Deep Reactive Ion Etch (DRIE) and Plasma Enhanced Chemical Vapor Deposition (PECVD) products, and the related intellectual property, directed at advanced 3D wafer-level packaging applications. The restricted stock......Please login or register with us to view this article>>
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