Manufacturing/Packaging 
3D-TSVs spark packaging revolution
Keywords: 3D-TSV wafers 3D integration with through-silicon vias
[Summary of tips] By 2013, 59 percent of 3D-TSV-packaged chips will come in stacks. (Click to view full image)Chips face the so-called "More-than-Moore" 3D integration route in order to pursue the continued aggressive scaling demanded by the historical law. The whole industry supply chain is involved, from IDMs to fabless companies and CMOS fou......Please login or register with us to view this article>>
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