Interface 
Laird Tech takes wrap off thermal interface material
Keywords: thermally conductive gap filler thermal interface material T-flex
[Summary of tips] Laird Technologies Inc. announced the launch of its T-flex 700 for use as a thermal interface material (TIM).The T-flex 700 is the next generation thermal pad in the T-flex gap filler line. It improves the thermal performance of the T-flex line by increasing the thermal conductivity to 5W/mK. The soft material is highly complia......Please login or register with us to view this article>>
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