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Qualcomm, IMEC team on 3D tech for wireless apps
Keywords: 3D design 3D packing wireless application
[Summary of tips] Qualcomm Inc. announced it is the first fabless IC firm to participate in IMEC's industrial affiliation program (IIAP) on 3D integration. Qualcomm and IMEC researchers in the program will collaborate to understand and develop solutions for the use of 3D technologies in future wireless products."Now that Qualcomm, the world's le......Please login or register with us to view this article>>
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