RF/Microwave 
Partition and package to miniaturize handsets
Keywords: 3D IC stacking system-in-package wafer-level packaging
[Summary of tips] The latest generation of mobile phone handsets and smart phone/PDAs has replaced the PC as the advanced technology driver for the electronics industry. The sheer volume alone is amazing, but the underlying story is the advanced technology that makes this increased volume possible. To meet changing form factors and performance r......Please login or register with us to view this article>>
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