Manufacturing/Packaging 
Singapore inventor gets patent for flip-chip IC assembly tech
Keywords: assembly method patent flip-chip device assembly
[Summary of tips] Teck Kheng Lee of Singapore has been granted U.S. patent for his development of a method for assembling a flip-chip semiconductor device.The invention, with U.S. Patent No. 7,348,215, assigned Micron Technology Inc., covers a method for assembly of one or more flip-chip-configured IC dice with an interposer substrate to form a ......Please login or register with us to view this article>>
|
Not yet registered?
 Register FREE to view unlimited features, tutorials and products, and enable any content alert service! |
Registered already? Login to view complete content.
|
Article Comments - Singapore inventor gets patent for f...
Visitor0213
(To avoid code verification, simply login or register with us. It is fast and free!)
Top Ranked Articles
Christmas Wishlist
All I want for Christmas is any of this year's Best of Innovations Design and Engineering Award honorees! Here's the EE Times pick for Top 10 CE gadgets.
Search EE Times Asia
Peek at Hot Gadgets for 2012
